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Prevention Treatment Product List

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G-type asbestos dispersion prevention, non-thermal harmless treatment, and reuse.

Even after hardening, it does not contain organic solvents, so the original fire resistance and heat resistance effects are not lost!

The method for preventing the dispersion of G-type asbestos and its harmless treatment involves "dispersion prevention treatment" and "needle-like crystal destruction treatment." Through the chemical reaction of sodium silicate or potassium silicate, which are the main components of alkaline silicate solution, with calcium, magnesium, and aluminum ions contained in the cement used as a binder during asbestos spraying, glass substances are generated on the surface of the asbestos. By increasing the specific gravity through the enlargement of needle-like crystals and the bonding between them, dispersion is prevented. Furthermore, as the ion exchange reaction progresses, the generation of silicates and colloidal silica (glass substances) also advances, resulting in the densification of the crystals and an increase in hardness. Crushing this material will destroy the needle-like crystals. After crushing, it can be reused as cement raw material or ceramic raw material. *For more details, please refer to the PDF document or feel free to contact us.

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[Case Study] Surface Treatment 'Odent Treatment'

High durability with no degradation in effectiveness even after 300,000 contacts! Compatible with manufacturing equipment for LCDs, organic ELs, etc.

We would like to introduce a case study of the anti-static treatment "Odent Treatment," which reduces the glass peeling and charging phenomenon. In the manufacturing process of liquid crystal devices, we received inquiries from customers who place glass substrates on a mounting table (made of aluminum) and perform various treatments. They reported, "During processing, the substrate becomes charged and sticks to the mounting table, and when trying to detach the glass substrate from the mounting table after processing, the glass substrate breaks, or semiconductor devices are damaged due to electrostatic discharge, which is a problem for us." The solution that met this requirement was the anti-static treatment technology "Odent Treatment," which does not require decharging equipment on the mounting table. After its adoption, the substrates no longer broke, resulting in improved yield in the manufacturing process. [Case Study] <Customer Inquiry> ■ The substrate becomes charged and sticks to the mounting table during processing, and when trying to detach the glass substrate from the mounting table after processing, the glass substrate breaks or semiconductor devices are damaged due to electrostatic discharge, which is a problem for us. <Feedback from Customers After Adopting Odent> ■ The substrates no longer break, leading to improved yield in the manufacturing process. ■ We have been using it for several years, and the performance is still sustained. *For more details, please refer to the PDF document or feel free to contact us.

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